| PART |
Description |
Maker |
| IBM11M32735C |
32M x 72 DRAM Module(32M x 72动态RAM模块) 32M × 72配置内存2M × 72配置动态内存模块）
|
International Business Machines, Corp.
|
| KMM374F3280BK |
32M x 72 DRAM DIMM(32M x 72 动RAM模块) 32M × 72配置的DRAM内存2M × 72配置动态内存模块）
|
Samsung Semiconductor Co., Ltd.
|
| 30211506 |
Switching module - EMG 30-S2/16A - 2944533
|
PHOENIX CONTACT
|
| TC58NS256ADC |
256-MBIT (32M x 8 BITS) CMOS NAND E PROM (32M BYTE SmartMedia)
|
TOSHIBA
|
| TC58256DC TC58256FT |
256M Bit (32M×8Bits ) CMOS NAND EEPROM(32M×8位与非EEPROM) 256M比特2M的8位）的CMOS闪存EEPROM的（32M的8位与非的EEPROM
|
Toshiba Corporation
Toshiba, Corp.
|
| W3H32M72E-667ES W3H32M72E-667ESM W3H32M72E-667ESI |
32M x 72 DDR2 SDRAM 208 PBGA Multi-Chip Package 32M × 72配置DDR2 SDRAM08 PBGA封装多芯片封
|
Atmel, Corp.
Honeywell International, Inc.
|
| LPCIE-7230 |
32-CH Isolated DIO Cards
|
List of Unclassifed Manufacturers
|
| ZMM55C10 ZMM55C11 ZMM55C12 ZMM55C13 ZMM55C15 ZMM55 |
Surface Mount Zener Dio de
|
SeCoS Halbleitertechnologie GmbH
|
| KMM53232000BV |
32M x 32 DRAM SIMM(32M x 32 动RAM模块)
|
SAMSUNG SEMICONDUCTOR CO. LTD.
|
| KMM375S3227BT |
32Mx72 SDRAM DIMM(32M x 72 动RAM模块) 32Mx72 SDRAM的内存（32M × 72配置动态内存模块）
|
Samsung Semiconductor Co., Ltd.
|
| Z2.302.0421.0 |
Terminal Block Ground Block; No. of Positions:1; Wire Size (AWG):2/0-6; Mounting Type:DIN Rail; Color:Yellow/Green MODULAR TERMINAL BLOCK
|
Wieland Electric, Inc.
WIELAND ELECTRIC INC
|
